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 SUD50P04-23
Vishay Siliconix
P-Channel 40-V (D-S), 175 C MOSFET
PRODUCT SUMMARY
VDS (V) - 40 RDS(on) () 0.023 at VGS = 10 V 0.030 at VGS = 4.5 V ID (A)a - 20 - 20 Qg (Typ.) 20.6 nC
FEATURES
* TrenchFET(R) Power MOSFET * 100 % Rg Tested
RoHS
COMPLIANT
APPLICATIONS
* LCD TV Inverter
TO-252
S
G Drain Connected to Tab G D S D P-Channel MOSFET
Top View Ordering Information: SUD50P04-23-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted
Parameter Drain-Source Voltage Gate-Source Voltage TC = 25 C TC = 100 C TA = 25 C TA = 100 C TC = 25 C TA = 25 C L = 0.1 mH TC = 25 C TC = 100 C TA = 25 C TA = 100 C Symbol VDS VGS Limit - 40 16 - 20a - 20a - 8.2b - 5.7b - 50 - 20a - 2.5b - 20 20 45.4 22.7 3.1b 1.5b - 55 to 175 Unit V
Continuous Drain Current (TJ = 150 C)
ID
Pulsed Drain Current Continuous Source-Drain Diode Current Single Pulse Avalanche Current Avalanche Energy
IDM IS IAS EAS
A
mJ
Maximum Power Dissipation
PD TJ, Tstg
W
Operating Junction and Storage Temperature Range
C
THERMAL RESISTANCE RATINGS
Parameter Maximum Junction-to-Ambientb Maximum Junction-to-Case Notes: a. Package limited. b. Surface mounted on 1" x 1" FR4 board. Steady State Steady State Symbol RthJA RthJC Typical 40 2.75 Maximum 48 3.3 Unit C/W
Document Number: 74423 S-81956-Rev. B, 25-Aug-08
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SUD50P04-23
Vishay Siliconix
SPECIFICATIONS TJ = 25 C, unless otherwise noted
Parameter Static Drain-Source Breakdown Voltage VDS Temperature Coefficient VGS(th) Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea VDS VDS/TJ VGS(th)/TJ VGS(th) IGSS IDSS ID(on) RDS(on) gfs Ciss Coss Crss Qg Qgs Qgd Rg td(on) tr td(off) tf td(on) tr td(off) tf IS ISM VSD trr Qrr ta tb IF = - 20 A, dI/dt = 100 A/s, TJ = 25 C IS = - 10 A - 0.85 44 53 18 26 TC = 25 C VDD = - 20 V, RL = 0.66 ID - 30 A, VGEN = - 10 V, Rg = 1 VDD = - 20 V, RL = 0.66 ID - 30 A, VGEN = - 4.5 V, Rg = 1 f = 1 MHz VDS = - 20 V, VGS = - 10 V, ID = - 30 A VDS = - 20 V, VGS = - 4.5 V, ID = - 30 A VDS = - 20 V, VGS = 0 V, f = 1 MHz VGS = 0 V, ID = - 250 A ID = - 250 A VDS = VGS, ID = - 250 A VDS = 0 V, VGS = 16 V VDS = - 40 V, VGS = 0 V VDS = - 40 V, VGS = 0 V, TJ = 100 C VDS - 5 V, VGS = - 10 V VGS = - 10 V, ID = - 15 A VGS = - 4.5 V, ID = - 10 A VDS = 15 V, ID = - 15 A - 30 0.019 0.024 30 1880 286 192 43.5 20.6 4.6 7.6 3 22 217 42 21 8 12 36 9 5 35 325 65 32 15 20 55 15 - 20 - 50 - 1.2 66 80 ns 65 31 nC pF 0.023 0.030 -0.8 - 40 - 40 3.7 -2 100 -1 - 20 V mV/C V nA A A S Symbol Test Conditions Min. Typ. Max. Unit
Forward Transconductancea Dynamicb Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulse Diode Forward Currenta Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Reverse Recovery Fall Time Reverse Recovery Rise Time
A V ns nC ns
Notes: a. Pulse test; pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Document Number: 74423 S-81956-Rev. B, 25-Aug-08
SUD50P04-23
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
80 VGS = 10 thru 4 V 64 I D - Drain Current (A) I D - Drain Current (A) 1.6 2.0
48
1.2
32 3V 16
0.8 TC = 125 C 0.4 25 C
0 0 1 2 3 4 5
0.0 0.0
- 55 C 0.6 1.2 1.8 2.4 3.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
50 TC = - 55 C RDS(on) - On-Resistance () g fs - Transconductance (S) 40 25 C 0.04 0.05
Transfer Characteristics
30
125 C
0.03
VGS = 4.5 V VGS = 10 V
20
0.02
10
0.01
0 0 7 14 ID - Drain Current (A) 21 28
0.00 0 16 32 48 64 80
ID - Drain Current (A)
Transconductance
0.20 3000
On-Resistance vs. Drain Current
R DS(on) - On-Resistance ()
0.16 C - Capacitance (pF)
2400 Ciss 1800
0.12
0.08 125 C 0.04 25 C 0.00 0 1 2 3 4 5 6 7 8 9 10
1200
600 Crss 0 0 8 16
Coss
24
32
40
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage Document Number: 74423 S-81956-Rev. B, 25-Aug-08
Capacitance www.vishay.com 3
SUD50P04-23
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
10 ID = 30 A VGS - Gate-to-Source Voltage (V) 8 R DS(on) - On-Resistance VDS = 20 V 6 1.8 2.1 ID = 15 A VGS = 4.5 V
(Normalized)
VDS = 10 V
1.5 VGS = 10 V 1.2
4 VDS = 30 V 2
0.9
0 0 10 20 30 40 50
0.6 - 50
- 25
0
25
50
75
100
125
150
175
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (C)
Gate Charge
100 0.7
On-Resistance vs. Junction Temperature
10 I S - Source Current (A)
TJ = 150 C
0.5 ID = 250 A VGS(th) (V)
1
0.3 ID = 5 mA 0.1
0.1
TJ = 25 C
0.01
- 0.1
0.001 0.00
0.2
0.4
0.6
0.8
1.0
1.2
- 0.3 - 50
- 25
0
25
50
75
100
125
150
175
VSD - Source-to-Drain Voltage (V)
TJ - Temperature (C)
Source-Drain Diode Forward Voltage
200 200
Threshold Voltage
160
160
Power (W)
Power (W)
120
120
80
80
40
40
0 0.001 0.01 0.1 Time (s) 1 10 100
0 0.001
0.01
0.1 Time (s)
1
10
Single Pulse Power, Junction-to-Ambient
Single Pulse Power, Junction-to-Case
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Document Number: 74423 S-81956-Rev. B, 25-Aug-08
SUD50P04-23
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
100 100 Limited by RDS(on)* I D - Drain Current (A) 10 100 s 1 ms 10 ms 100 ms DC
Limited by RDS(on)* I D - Drain Current (A) 10 1 ms 10 ms 1 100 ms 1s TA = 25 C Single Pulse 10 s DC BVDSS Limited 0.01 0.01 0.1 1 10 100 VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified
1
0.1
0.1
TC = 25 C Single Pulse
BVDSS Limited 0.01 0.01 0.1 1 10 100
VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
9 35 7 I D - Drain Current (A) 28 5 I D - Drain Current (A)
Safe Operating Area, Junction-to-Case
21
4
14
Package Limited
2
7
0 0 25 50 75 100 125 150 175
0 0 25 50 75 100 125 150 175
TA - Ambient Temperature (C)
TA - Ambient Temperature (C)
Current Derating**, Junction-to-Ambient
Current Derating**, Junction-to-Case
** The power dissipation PD is based on TJ(max) = 175 C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit.
Document Number: 74423 S-81956-Rev. B, 25-Aug-08
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SUD50P04-23
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
3.70 55
2.96
44
Power (W)
Power (W)
2.22
33
1.48
22
0.74
11
0.00 0 25 50 75 100 125 150 175
0 0 25 50 75 100 125 150 175
TA - Ambient Temperature (C)
TC - Case Temperature (C)
Power Derating*, Junction-to-Ambient
Power Derating*, Junction-to-Case
* The power dissipation PD is based on TJ(max) = 175 C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit.
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Document Number: 74423 S-81956-Rev. B, 25-Aug-08
SUD50P04-23
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
1
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05
Notes: PDM t1 t2 1. Duty Cycle, D =
0.02 0.01 10-4 Single Pulse 10-3 10-2 10-1 1 10
2. Per Unit Base = RthJA = 48 C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
t1 t2
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance 0.2 0.1
0.1 0.05 Single Pulse 0.02
0.01 10 -4 10 -3 10 -2 10 -1 Square Wave Pulse Duration (s) 1 10
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?74423.
Document Number: 74423 S-81956-Rev. B, 25-Aug-08
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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